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Publication search results
found 50 matches
- 2013
- Naoya Azuma, Shunsuke Shimazaki, Noriyuki Miura, Makoto Nagata
, Tomomitsu Kitamura, Satoru Takahashi, Motoki Murakami, Kazuaki Hori, Atsushi Nakamura, Kenta Tsukamoto, Mizuki Iwanami, Eiji Hankui, Sho Muroga
, Yasushi Endo
, Satoshi Tanaka, Masahiro Yamaguchi:
Measurements and simulation of substrate noise coupling in RF ICs with CMOS digital noise emulator. EMC Compo 2013: 42-46 - Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim:
Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment. EMC Compo 2013: 238-242 - Néstor Berbel, Raúl Fernández-García, Ignacio Gil
:
Characterization of conducted emission at high frequency under different temperature. EMC Compo 2013: 147-151 - Alexandre Boyer, Sonia Ben Dhia:
Characterization and modeling of electrical stresses on digital integrated circuits power integrity and conducted emission. EMC Compo 2013: 190-195 - Marco Cazzaniga
, Patrice Joubert Doriol, Aurora Sanna, Emmanuel Blanc, Valentino Liberali
, Davide Pandini:
Evaluating the impact of substrate noise on conducted EMI in automotive microcontrollers. EMC Compo 2013: 129-133 - Yin-Cheng Chang, Shawn S. H. Hsu, Yen-Tang Chang, Chiu-Kuo Chen, Hsu-Chen Cheng, Da-Chiang Chang:
The direct RF power injection method up to 18 GHz for investigating IC's susceptibility. EMC Compo 2013: 167-170 - Bernd Deutschmann
:
Spread spectrum clocking for emission reduction of charge pump applications. EMC Compo 2013: 123-128 - Sonia Ben Dhia, Alexandre Boyer:
Electro-magnetic robustness of integrated circuits: from statement to prediction. EMC Compo 2013: 208-213 - André Durier
, Christian Marot, Olivier Crépel:
Using the EM simulation tools to predict the Conducted Emissions level of a DC/DC boost converter: Introducing EBEM-CE model. EMC Compo 2013: 152-157 - Haruya Fujita, Hiroki Takatani, Yosuke Tanaka, Shohei Kawaguchi, Masaomi Sato, Toshio Sudo:
Evaluation of PDN impedance and power supply noise for different on-chip decoupling structures. EMC Compo 2013: 142-146 - Tsuyoshi Funaki:
A study on gate voltage fluctuation of MOSFET induced by switching operation of adjacent MOSFET in high voltage power conversion circuit. EMC Compo 2013: 113-118 - Renaud Gillon
, Niko Bako, Adrijan Baric:
Broadband detection of radiating moments using the TEM-cell and a phase-calibrated oscilloscope. EMC Compo 2013: 27-32 - L. Guibert, P. Millot, Xavier Ferrières, Etienne Sicard:
Study of radiated immunity of an electronic system in a reverberating chamber. EMC Compo 2013: 74-77 - Siham Hairoud, Tristan Dubois
, Angelique Tetelin, Geneviève Duchamp:
Conducted immunity of three Op-Amps using the DPI measurement technique and VHDL-AMS modeling. EMC Compo 2013: 53-58 - Yu-ichi Hayashi, Naofumi Homma, Takafumi Aoki, Yuichiro Okugawa, Yoshiharu Akiyama:
Transient analysis of EM radiation associated with information leakage from cryptographic ICs. EMC Compo 2013: 78-82 - Wataru Ichimura, Sho Kiyoshige, Masahiro Terasaki, Ryota Kobayashi, Genki Kubo, Hiroki Otsuka, Toshio Sudo:
Anti-resonance peak frequency control by variable on-die capacitance. EMC Compo 2013: 171-174 - Kengo Iokibe, Yoshitaka Toyota:
Estimation of data-dependent power voltage variations of FPGA by equivalent circuit modeling from on-board measurements. EMC Compo 2013: 175-179 - Sylvie Jarrix, Jérémy Raoult, Adrien Doridant, Clovis Pouant, Patrick Hoffmann:
Discrete low-frequency transistors subjected to high-frequency CW and pulse-modulated sine signals. EMC Compo 2013: 220-225 - Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Modeling and analysis of open defect in through silicon via (TSV) channel. EMC Compo 2013: 163-166 - Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park:
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. EMC Compo 2013: 5-9 - Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park:
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. EMC Compo 2013: 158-162 - KyungSoo Kim, Wansoo Nah, SoYoung Kim:
Noise-immune design of Schmitt trigger logic gate using DTMOS for sub-threshold circuits. EMC Compo 2013: 83-88 - Tomohiro Kinoshita, Shoichi Hara, Eiji Takahashi, Kazuhide Uriu:
A technique for estimating signal waveforms at inaccessible points in high speed digital circuits. EMC Compo 2013: 1-4 - Yosuke Kondo, Kei Tsunada, Norimasa Oka, Masato Izumichi:
Immunity simulation method for automotive power module using electromagnetic analysis. EMC Compo 2013: 243-248 - Sjoerd Op't Land, Richard Perdriau, Mohammed Ramdani, Olivier Maurice
, M'hamed Drissi:
Kron simulation of field-to-line coupling using a meshed and a modified Taylor cell. EMC Compo 2013: 15-20 - Masaaki Maeda, Tohlu Matsushima
, Osami Wada
:
Impedance balance control for suppression of fluctuation on ground voltage in LSI package. EMC Compo 2013: 134-137 - Tvrtko Mandic, Renaud Gillon
, Adrijan Baric:
IC-Stripline design optimization using response surface methodology. EMC Compo 2013: 69-73 - Tohlu Matsushima
, Nobuaki Ikehara, Takashi Hisakado, Osami Wada
:
Improvement of reproducibility of DPI method to quantify RF conducted immunity of LDO regulator. EMC Compo 2013: 59-62 - Sergey Miropolsky, Alexander Sapadinsky, Stephan Frei
:
A generalized accurate modelling method for automotive bulk current injection (BCI) test setups up to 1 GHz. EMC Compo 2013: 63-68 - Akitaka Murata, Shuji Agatsuma, Daisaku Ikoma, Kouji Ichikawa, Takahiro Tsuda, Makoto Nagata
, Kumpei Yoshikawa, Yuuki Araga, Yuji Harada:
Noise analysis using on-chip waveform monitor in bandgap voltage references. EMC Compo 2013: 226-231
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