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@proceedings{DBLP:conf/3dic/2011,
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
publisher = {{IEEE}},
year = {2012},
url = {https://ieeexplore.ieee.org/xpl/conhome/6253019/proceeding},
isbn = {978-1-4673-2189-1},
timestamp = {Wed, 16 Oct 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/2011.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/AokiHT11,
author = {Mayu Aoki and
Kazuyuki Hozawa and
Kenichi Takeda},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Void reduction in wafer bonding by simultaneously formed ventilation
channels},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262992},
doi = {10.1109/3DIC.2012.6262992},
timestamp = {Wed, 16 Oct 2019 14:14:50 +0200},
biburl = {https://dblp.org/rec/conf/3dic/AokiHT11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/AragaNPKMMTLMZB11,
author = {Yuuki Araga and
Makoto Nagata and
Geert Van der Plas and
Jaemin Kim and
Nikolaos Minas and
Pol Marchal and
Youssef Travaly and
Michael Libois and
Antonio La Manna and
Wenqi Zhang and
Eric Beyne},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {In-tier diagnosis of power domains in 3D {TSV} ICs},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262964},
doi = {10.1109/3DIC.2012.6262964},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/AragaNPKMMTLMZB11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/AungLYK11,
author = {Myat Thu Linn Aung and
Eric Teck Heng Lim and
Takefumi Yoshikawa and
Tony Tae{-}Hyoung Kim},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Design of capacitive-coupling-based simultaneously bi-directional
transceivers for 3DIC},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263046},
doi = {10.1109/3DIC.2012.6263046},
timestamp = {Sat, 18 Mar 2023 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/AungLYK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/Beyne11,
author = {Eric Beyne},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Electrical, thermal and mechanical impact of 3D {TSV} and 3D stacking
technology on advanced {CMOS} devices - Technology directions},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262977},
doi = {10.1109/3DIC.2012.6262977},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/Beyne11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/BuchananTGCACT11,
author = {Keith Buchanan and
Dave Thomas and
Hefin Griffiths and
Kathrine Crook and
Daniel Archard and
Mark Carruthers and
Masahiko Tanaka},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Plasma etch and dielectric deposition processes for {TSV} Reveal},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--2},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262986},
doi = {10.1109/3DIC.2012.6262986},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/BuchananTGCACT11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ChePHTGG11,
author = {Fa Xing Che and
Wahyuaji Narottama Putra and
A. Heryanto and
A. Trigg and
S. Gao and
Chee Lip Gan},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Numerical and experimental study on Cu protrusion of Cu-filled through-silicon
vias {(TSV)}},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262985},
doi = {10.1109/3DIC.2012.6262985},
timestamp = {Sat, 30 Sep 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ChePHTGG11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ChenXLKCHLCHKFCLL11,
author = {Kuan{-}Neng Chen and
Z. Xu and
Fei Liu and
Cheng{-}Ta Ko and
Chuan{-}An Cheng and
W. C. Huang and
H. L. Lin and
C. Cabral and
Zhi{-}Cheng Hsiao and
N. Klymko and
Hsin{-}Chia Fu and
Y. H. Chen and
Jian{-}Qiang Lu and
Wei{-}Chung Lo},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Cu-based bonding technology for 3D integration applications},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262974},
doi = {10.1109/3DIC.2012.6262974},
timestamp = {Sat, 20 Apr 2024 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ChenXLKCHLCHKFCLL11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ChoaLK11,
author = {Sung{-}Hoon Choa and
Haeng{-}Soo Lee and
Kyoung{-}Ho Kim},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Numerical analysis of bonding process-induced deformation for 3D package},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263000},
doi = {10.1109/3DIC.2012.6263000},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ChoaLK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/CioccioTCMCS11,
author = {L{\'{e}}a Di Cioccio and
Rachid Taibi and
C{\'{e}}drick Chappaz and
St{\'{e}}phane Moreau and
Laurent{-}Luc Chapelon and
Thomas Signamarcheix},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {200{\textdegree}C direct bonding copper interconnects : Electrical
results and reliability},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262976},
doi = {10.1109/3DIC.2012.6262976},
timestamp = {Tue, 16 Jul 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/CioccioTCMCS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/CubilloWOLCBP11,
author = {Joseph Romen Cubillo and
Roshan Weerasekera and
Zaw Zaw Oo and
En{-}Xiao Liu and
Bob Conn and
Surya Bhattacharya and
Robert Patti},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Interconnect design and analysis for Through Silicon Interposers (TSIs)},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263039},
doi = {10.1109/3DIC.2012.6263039},
timestamp = {Sat, 30 Sep 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/CubilloWOLCBP11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/DaneshtalabELPT11,
author = {Masoud Daneshtalab and
Masoumeh Ebrahimi and
Pasi Liljeberg and
Juha Plosila and
Hannu Tenhunen},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Memory-efficient logic layer communication platform for 3D-stacked
memory-on-processor architectures},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--8},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263024},
doi = {10.1109/3DIC.2012.6263024},
timestamp = {Sat, 16 Sep 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/DaneshtalabELPT11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/DaneshtalabEP11,
author = {Masoud Daneshtalab and
Masoumeh Ebrahimi and
Juha Plosila},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {{HIBS} - Novel inter-layer bus structure for stacked architectures},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--7},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263037},
doi = {10.1109/3DIC.2012.6263037},
timestamp = {Sat, 16 Sep 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/DaneshtalabEP11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/DruaisAACCCCCCCCDDFGHHLLMOPPRRSS11,
author = {G. Druais and
Pascal Ancey and
C. Aumont and
V. Caubet and
Laurent{-}Luc Chapelon and
C. Chaton and
S{\'{e}}verine Cheramy and
S. Cordova and
E. Cirot and
Jean{-}Philippe Colonna and
Perceval Coudrain and
T. Divel and
Y. Dodo and
Alexis Farcy and
N. Guitard and
K. Haxaire and
Nicolas Hotellier and
F. Leverd and
R. Liou and
Jean Michailos and
A. Ostrovsky and
Sebastien Petitdidier and
J. Pruvost and
D. Riquet and
O. Robin and
E. Saugier and
Nicolas Sillon},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {3D integration demonstration of a wireless product with design partitioning},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262962},
doi = {10.1109/3DIC.2012.6262962},
timestamp = {Thu, 21 Jan 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/DruaisAACCCCCCCCDDFGHHLLMOPPRRSS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/EgawaFNEMTK11,
author = {Ryusuke Egawa and
Yusuke Funaya and
Ryu{-}ichi Nagaoka and
Yusuke Endo and
Akihiro Musa and
Hiroyuki Takizawa and
Hiroaki Kobayashi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Effects of 3-D stacked vector cache on energy consumption},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263026},
doi = {10.1109/3DIC.2012.6263026},
timestamp = {Mon, 26 Jun 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/EgawaFNEMTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/EnginR11,
author = {A. Ege Engin and
N. Srinidhi Raghavan},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Metal semiconductor {(MES)} TSVs in 3D ICs: Electrical modeling and
design},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263049},
doi = {10.1109/3DIC.2012.6263049},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/EnginR11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/Enquist11,
author = {P. Enquist},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Scalable direct bond technology and applications driving adoption},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263013},
doi = {10.1109/3DIC.2012.6263013},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/Enquist11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FranzonDZPHKS11,
author = {Paul D. Franzon and
W. Rhett Davis and
Zheng Zhou and
Shivam Priyadarshi and
Matthew Hogan and
Tanay Karnik and
Ganapti Srinavas},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Coordinating 3D designs: Interface IP, standards or free form?},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--3},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262960},
doi = {10.1109/3DIC.2012.6262960},
timestamp = {Sun, 02 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/FranzonDZPHKS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaOBMLTK11,
author = {Takafumi Fukushima and
Yuki Ohara and
Jichoel Bea and
Mariappan Murugesan and
Kang Wook Lee and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Temporary bonding strength control for self-assembly-based 3D integration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262954},
doi = {10.1109/3DIC.2012.6262954},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaOBMLTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FurutaO11,
author = {Futoshi Furuta and
Kenichi Osada},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {6 Tbps/W, 1 Tbps/mm\({}^{\mbox{2}}\), 3D interconnect using adaptive
timing control and low capacitance {TSV}},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262963},
doi = {10.1109/3DIC.2012.6262963},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/FurutaO11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HalderWPMMBSB11,
author = {Sandip Halder and
Ingrid De Wolf and
Alain Phommahaxay and
Andy Miller and
Mireille Maenhoudt and
Gerald Beyer and
Bart Swinnen and
Eric Beyne},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {In-line metrology and inspection for process control during 3D stacking
of IC's},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263006},
doi = {10.1109/3DIC.2012.6263006},
timestamp = {Sun, 02 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/HalderWPMMBSB11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HammamiMH11,
author = {Omar Hammami and
A. M'zah and
Khawla Hamwi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Design of 3D-IC for butterfly {NOC} based 64 PE-multicore: Analysis
and design space exploration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263029},
doi = {10.1109/3DIC.2012.6263029},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/HammamiMH11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HanadaSIM11,
author = {Takaaki Hanada and
Hiroshi Sasaki and
Koji Inoue and
Kazuaki J. Murakami},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Performance evaluation of 3D stacked multi-core processors with temperature
consideration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263025},
doi = {10.1109/3DIC.2012.6263025},
timestamp = {Fri, 17 Apr 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/HanadaSIM11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HatanakaJT11,
author = {Teruyoshi Hatanaka and
Koh Johguchi and
Ken Takeuchi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A 3D-Integration method to compensate output voltage degradation of
boost converter for compact Solid-State-Drives},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263023},
doi = {10.1109/3DIC.2012.6263023},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/HatanakaJT11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HayaseMN11,
author = {Masanori Hayase and
Naoki Mizukoshi and
Masayuki Nagao},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Copper deep via superfilling by selective accelerator deactivation},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262982},
doi = {10.1109/3DIC.2012.6262982},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/HayaseMN11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HayashiKTSSOMTB11,
author = {Taro Hayashi and
Kazuo Kondo and
Minoru Takeuchi and
Yushi Suzuki and
Takeyasu Saito and
Naoki Okamoto and
Masao Marunaka and
Takayuki Tsuchiya and
Masaru Bunya},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {3D interconnected technology by high speed copper electrodeposition
using diallylamine levelers},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262983},
doi = {10.1109/3DIC.2012.6262983},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/HayashiKTSSOMTB11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HeinigS11,
author = {Andy Heinig and
Christoph Sohrmann},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Multi-step approach for thermal optimization of 3D-IC and package},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263035},
doi = {10.1109/3DIC.2012.6263035},
timestamp = {Mon, 29 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/HeinigS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HozawaFHATSLFK11,
author = {Kazuyuki Hozawa and
Futoshi Furuta and
Yuko Hanaoka and
Mayu Aoki and
Kenichi Takeda and
Katsuyuki Sakuma and
Kang Wook Lee and
Takafumi Fukushima and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Chip-level {TSV} integration for rapid prototyping of 3D system LSIs},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262952},
doi = {10.1109/3DIC.2012.6262952},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/HozawaFHATSLFK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HuLLRJMBBY11,
author = {Y. H. Hu and
C. S. Liu and
M. J. Lii and
Kenneth J. Rebibis and
Anne Jourdain and
Antonio La Manna and
Gerald Beyer and
Eric Beyne and
C. H. Yu},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {3D stacking using Cu-Cu direct bonding},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262944},
doi = {10.1109/3DIC.2012.6262944},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/HuLLRJMBBY11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/IkedaOKMMKOYK11,
author = {Toru Ikeda and
Masatoshi Oka and
Shinya Kawahara and
Noriyuki Miyazaki and
Keiji Matsumoto and
Sayuri Kohara and
Yasumitsu Orii and
Fumiaki Yamada and
Morihiro Kada},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Combination between the nonlinear finite element analyses and the
strain measurement using the digital image correlation for a new 3D
{SIC} package},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262999},
doi = {10.1109/3DIC.2012.6262999},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/IkedaOKMMKOYK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/IkedaWA11,
author = {Akihiro Ikeda and
Naoya Watanabe and
Tanemasa Asano},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {High frequency signal transmission characteristics of cone bump interconnections},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263011},
doi = {10.1109/3DIC.2012.6263011},
timestamp = {Thu, 11 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/IkedaWA11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/IkeuchiTS11,
author = {Katsuyuki Ikeuchi and
Makoto Takamiya and
Takayasu Sakurai},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Through Silicon Capacitive Coupling {(TSCC)} interface for 3D stacked
dies},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263045},
doi = {10.1109/3DIC.2012.6263045},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/IkeuchiTS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/InouePRALMASISSYS11,
author = {Fumihiro Inoue and
Harold Philipsen and
Alex Radisic and
Silvia Armini and
Peter Leunissen and
Hiroshi Miyake and
Ryohei Arima and
Tomohiro Shimizu and
Toshiaki Ito and
Hirofumi Seki and
Yuko Shinozaki and
Tomohiko Yamamoto and
Shoso Shingubara},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Low temperature through-Si via fabrication using electroless deposition},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262984},
doi = {10.1109/3DIC.2012.6262984},
timestamp = {Sun, 25 Oct 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/InouePRALMASISSYS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/Ishihara11,
author = {Hideaki Ishihara},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Evolutional Directions of Smart Automotive Systems and Semiconductors},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262980},
doi = {10.1109/3DIC.2012.6262980},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/Ishihara11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ItabashiKZZFTI11,
author = {Toshiaki Itabashi and
Masashi Kotani and
Melvin P. Zussman and
K. Zoschke and
T. Fischer and
M. Topper and
Hiroyuki Ishida},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {High temperature bonding solutions enabling thin wafer process and
handling on 3D-IC manufacturing},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263003},
doi = {10.1109/3DIC.2012.6263003},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ItabashiKZZFTI11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ItoTACFK11,
author = {Yuka Ito and
Shinsuke Terada and
Shinya Arai and
Koji Choki and
Takafumi Fukushima and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {High-bandwidth data transmission of new transceiver module through
optical interconnection},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263010},
doi = {10.1109/3DIC.2012.6263010},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/ItoTACFK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/IvankovicPMCCMMGEZBDMVBBVWV11,
author = {Andrej Ivankovic and
Geert Van der Plas and
V. Moroz and
M. Choi and
Vladimir Cherman and
Abdelkarim Mercha and
Paul Marchal and
Marcel Gonzalez and
Geert Eneman and
Wenqi Zhang and
Thibault Buisson and
Mikael Detalle and
Antonio La Manna and
Diederik Verkest and
Gerald Beyer and
Eric Beyne and
Bart Vandevelde and
Ingrid De Wolf and
Dirk Vandepitte},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Analysis of microbump induced stress effects in 3D stacked {IC} technologies},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262972},
doi = {10.1109/3DIC.2012.6262972},
timestamp = {Mon, 19 Jun 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/IvankovicPMCCMMGEZBDMVBBVWV11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/JabbarHH11,
author = {Mohamad Hairol Jabbar and
Dominique Houzet and
Omar Hammami},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {3D multiprocessor with 3D NoC architecture based on Tezzaron technology},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263027},
doi = {10.1109/3DIC.2012.6263027},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/JabbarHH11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KangCYJBLKKCMP11,
author = {Sinwoo Kang and
Sungdong Cho and
Kiyoung Yun and
Sangwook Ji and
Kisoon Bae and
Woonseob Lee and
Eunji Kim and
Jangho Kim and
Jonghoon Cho and
Hyongyol Mun and
Yeong L. Park},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {{TSV} optimization for {BEOL} interconnection in logic process},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262947},
doi = {10.1109/3DIC.2012.6262947},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KangCYJBLKKCMP11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KangKKLJLKK11,
author = {Sung{-}Geun Kang and
Youngrae Kim and
Eun{-}Sol Kim and
Naeun Lim and
Teakgyu Jeong and
Jieun Lee and
Sarah Eunkyung Kim and
Sungdong Kim},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Evaluation of wafer level Cu bonding for 3D integration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--2},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263014},
doi = {10.1109/3DIC.2012.6263014},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KangKKLJLKK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KatoKNA11,
author = {Fumiki Kato and
Katsuya Kikuchi and
Hiroshi Nakagawa and
Masahiro Aoyagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Hot spots suppression by high thermal conductivity film in thin-sub
strate {CMOS} ICs for 3D integration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263005},
doi = {10.1109/3DIC.2012.6263005},
timestamp = {Fri, 02 Nov 2018 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/KatoKNA11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KiKYL11,
author = {Won{-}Myoung Ki and
Myong{-}Suk Kang and
Sehoon Yoo and
Chang{-}Woo Lee},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Fabrication and bonding process of fine pitch Cu pillar bump on thin
Si chip for 3D stacking {IC}},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263016},
doi = {10.1109/3DIC.2012.6263016},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KiKYL11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KikuchiUFAWKGOKKAO11,
author = {Katsuya Kikuchi and
Chihiro Ueda and
Fumiaki Fujii and
Yutaka Akiyama and
Naoya Watanabe and
Yasuhiro Kitamura and
Toshio Gomyo and
Toshikazu Okubo and
Tetsuya Koyama and
Tadashi Kamada and
Masahiro Aoyagi and
Kanji Otsuka},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {{PDN} impedance analysis of TSV-decoupling capacitor embedded Silicon
interposer for 3D-integrated {CMOS} image sensor system},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263017},
doi = {10.1109/3DIC.2012.6263017},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KikuchiUFAWKGOKKAO11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KitaichiSMASY11,
author = {Kosuke Kitaichi and
Haruo Shimamoto and
Chuichi Miyazaki and
Yoshiyuki Abe and
Sigeaki Saito and
Shoji Yasunaga},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Development of high accuracy wafer thinning and pickup technology
for thin wafer},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262993},
doi = {10.1109/3DIC.2012.6262993},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KitaichiSMASY11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KiyoyamaLFNKTK11,
author = {Kouji Kiyoyama and
Kang Wook Lee and
Takafumi Fukushima and
H. Naganuma and
H. Kobayashi and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A very low area {ADC} for 3-D stacked {CMOS} image processing system},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262958},
doi = {10.1109/3DIC.2012.6262958},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/KiyoyamaLFNKTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KoHCCHFHCTCLC11,
author = {Cheng{-}Ta Ko and
Zhi{-}Cheng Hsiao and
Y. J. Chang and
Peng{-}Shu Chen and
J. H. Huang and
Hsin{-}Chia Fu and
Y. J. Huang and
C. W. Chiang and
W. L. Tsat and
Y. H. Chen and
Wei{-}Chung Lo and
Kuan{-}Neng Chen},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Wafer-level 3D integration with Cu {TSV} and micro-bump/adhesive hybrid
bonding technologies},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262949},
doi = {10.1109/3DIC.2012.6262949},
timestamp = {Sat, 16 Sep 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KoHCCHFHCTCLC11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KoKKSYL11,
author = {Young{-}Ki Ko and
Myong{-}Suk Kang and
Hiroyuki Kokawa and
Yutaka S. Sato and
Sehoon Yoo and
Chang{-}Woo Lee},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Advanced {TSV} filling method with Sn alloy and its reliability},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262988},
doi = {10.1109/3DIC.2012.6262988},
timestamp = {Sun, 25 Oct 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KoKKSYL11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KoharaHSMYOSKK11,
author = {Sayuri Kohara and
Akihiro Horibe and
Kuniaki Sueoka and
Keiji Matsumoto and
Fumiaki Yamada and
Yasumitsu Orii and
Katsuyuki Sakuma and
Takahiro Kinoshita and
Takashi Kawakami},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Thermal stress analysis of die stacks with fine-pitch {IMC} interconnections
for 3D integration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--7},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263002},
doi = {10.1109/3DIC.2012.6263002},
timestamp = {Sat, 19 Oct 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KoharaHSMYOSKK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KonishiYH11,
author = {Tomoaki Konishi and
Hiroyuki Yotsuyanagi and
Masaki Hashizume},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Supply current testing of open defects at interconnects in 3D Ics
with {IEEE} 1149.1 architecture},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262968},
doi = {10.1109/3DIC.2012.6262968},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KonishiYH11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KwakKP11,
author = {Byung{-}Hyun Kwak and
Sung{-}Hyuk Kim and
Young{-}Bae Park},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Current stressing effect on interfacial reaction characteristics of
Cu pillar/Sn-3.5Ag microbumps for 3D integration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--2},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263004},
doi = {10.1109/3DIC.2012.6263004},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KwakKP11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KwonHCLLKKKP11,
author = {Nam Hee Kwon and
S. M. Hong and
Yong{-}Won Cha and
Sun Jae Lee and
Han Gyul Lee and
Areum Kim and
Soo Won Kim and
Chang Hyun Kim and
Sung Gyu Pyo},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Effect of planarity on the 3D integration in 3-D integrated {CMOS}
image sensor},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--3},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263018},
doi = {10.1109/3DIC.2012.6263018},
timestamp = {Fri, 13 May 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KwonHCLLKKKP11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/Lau11,
author = {John H. Lau},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Recent advances and new trends in nanotechnology and 3D integration
for semiconductor industry},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--23},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262979},
doi = {10.1109/3DIC.2012.6262979},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/Lau11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeBFOTK11,
author = {Kang Wook Lee and
Jichoel Bea and
Takafumi Fukushima and
Yuki Ohara and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {High reliable and fine size of 5-{\(\mu\)}m diameter backside Cu through-silicon
Via(TSV) for high reliability and high-end 3-D LSIs},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262975},
doi = {10.1109/3DIC.2012.6262975},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LeeBFOTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeJBK11,
author = {Gyujei Lee and
Suk{-}woo Jeon and
Kwang{-}yoo Byun and
Dongil Kwon},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Mechanical characterization of residual stress around {TSV} through
instrumented indentation algorithm},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262996},
doi = {10.1109/3DIC.2012.6262996},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LeeJBK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeYSLK11,
author = {Jae Hak Lee and
Choong D. Yoo and
Jun{-}Yeob Song and
Seung S. Lee and
Sun{-}Rak Kim},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A study on the edge traces technique for 3D stack chip},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262995},
doi = {10.1109/3DIC.2012.6262995},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LeeYSLK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LiXOBHHCK11,
author = {H. Y. Li and
L. Xie and
L. G. Ong and
A. Baram and
I. Herer and
Arnon Hirshberg and
S. C. Chong and
D. L. Kwong},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Ultra-compact micro-coil realized via multilevel dense {TSV} coil
for MEMs application},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263008},
doi = {10.1109/3DIC.2012.6263008},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LiXOBHHCK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LiaoZL11,
author = {Xiongfei Liao and
Jun Zhou and
Xin Liu},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Exploring {AMBA} {AXI} on-Chip interconnection for TSV-based 3D SoCs},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263036},
doi = {10.1109/3DIC.2012.6263036},
timestamp = {Wed, 13 May 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LiaoZL11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LimLT11,
author = {Dau Fatt Lim and
K. C. Leong and
Chuan Seng Tan},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Selection of underfill material in Cu hybrid bonding and its effect
on the transistor keep-out-zone},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262981},
doi = {10.1109/3DIC.2012.6262981},
timestamp = {Sun, 31 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LimLT11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LimP11,
author = {Hong{-}Yeol Lim and
Gi{-}Ho Park},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Adaptive prefetching scheme for exploiting massive memory bandwidth
of 3-D {IC} technology},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263038},
doi = {10.1109/3DIC.2012.6263038},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LimP11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LiuWJLLCRGGHGJ11,
author = {Xin Liu and
Lei Wang and
Mini Jayakrishnan and
Jingjing Lan and
Hongyu Li and
Chong Ser Choong and
M. Kumarasamy Raja and
Yongxin Guo and
Wang Ling Goh and
Jin He and
Shan Gao and
Minkyu Je},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A miniaturized heterogeneous wireless sensor node in 3DIC},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262966},
doi = {10.1109/3DIC.2012.6262966},
timestamp = {Fri, 02 Nov 2018 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LiuWJLLCRGGHGJ11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MaedaKHEKFMSNKAO11,
author = {Nobuhide Maeda and
Young{-}Suk Kim and
Y. Hikosaka and
T. Eshita and
Hideki Kitada and
K. Fujimoto and
Yoriko Mizushima and
K. Suzuki and
Tadao Nakamura and
Akihito Kawai and
Kazuhisa Arai and
Takayuki Ohba},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Development of ultra-thinning technology for logic and memory heterogeneous
stack applications},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262991},
doi = {10.1109/3DIC.2012.6262991},
timestamp = {Thu, 21 Feb 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MaedaKHEKFMSNKAO11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MannaVBDRZB11,
author = {Antonio La Manna and
Dimitrios Velenis and
Thibault Buisson and
Mikael Detalle and
Kenneth J. Rebibis and
Wenqi Zhang and
Eric Beyne},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {3D stacking using ultra thin dies},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262951},
doi = {10.1109/3DIC.2012.6262951},
timestamp = {Mon, 19 Jun 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MannaVBDRZB11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MehdipourNGIM11,
author = {Farhad Mehdipour and
Krishna Chaitanya Nunna and
Lovic Gauthier and
Koji Inoue and
Kazuaki J. Murakami},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A thermal-aware mapping algorithm for reducing peak temperature of
an accelerator deployed in a 3D stack},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263034},
doi = {10.1109/3DIC.2012.6263034},
timestamp = {Mon, 06 Apr 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MehdipourNGIM11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MermozSCBDF11,
author = {Sebastien Mermoz and
Loic Sanchez and
L{\'{e}}a Di Cioccio and
Jean Berthier and
Emilie Deloffre and
Christian Fretigny},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Impact of containment and deposition method on sub-micron chip-to-wafer
self-assembly yield},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262953},
doi = {10.1109/3DIC.2012.6262953},
timestamp = {Wed, 18 May 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MermozSCBDF11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MiTUN11,
author = {Xiaoyu Mi and
Osamu Toyoda and
Satoshi Ueda and
Fumihiko Nakazawa},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A 3D heterogeneous integration method using {LTCC} wafer for {RF}
applications},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262955},
doi = {10.1109/3DIC.2012.6262955},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MiTUN11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MoallempourRZ11,
author = {Seyyed Hasan Moallempour and
Seyyed Ahmad Razavi and
Morteza Saheb Zamani},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {{TSV} reduction in homogeneous 3D FPGAs by logic resource and input
pad replication},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263033},
doi = {10.1109/3DIC.2012.6263033},
timestamp = {Fri, 02 Nov 2018 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MoallempourRZ11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MoserABLMNRW11,
author = {Hans{-}G{\"{u}}nther Moser and
Ladislav Andricek and
Michael Beimforde and
G. Liemann and
Anna Macchiolo and
Richard Nisius and
Rainer Helmut Richter and
Philipp Weigell},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Development of pixel detectors for particle physics using {SLID-ICV}
interconnection technology},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263021},
doi = {10.1109/3DIC.2012.6263021},
timestamp = {Sat, 30 Sep 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MoserABLMNRW11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MotoyoshiTFAK11,
author = {Makoto Motoyoshi and
Junichi Takanohashi and
Takafumi Fukushima and
Yasuo Arai and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Stacked {SOI} pixel detector using versatile fine pitch {\(\mu\)}-bump
technology},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262959},
doi = {10.1109/3DIC.2012.6262959},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MotoyoshiTFAK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanHKFTK11,
author = {Mariappan Murugesan and
Hideto Hashiguchi and
Harufumi Kobayashi and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262970},
doi = {10.1109/3DIC.2012.6262970},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanHKFTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanKFTK11,
author = {Mariappan Murugesan and
Harufumi Kobayashi and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {High density Cu-TSVs and reliability issues},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262969},
doi = {10.1109/3DIC.2012.6262969},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanKFTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NadipalliFLWYT11,
author = {Revanth Nadipalli and
Ji Fan and
Holden King Ho Li and
Keng Hoong Wee and
Hao Yu and
Chuan Seng Tan},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {3D integration of {MEMS} and {CMOS} via Cu-Cu bonding with simultaneous
formation of electrical, mechanical and hermetic bonds},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262956},
doi = {10.1109/3DIC.2012.6262956},
timestamp = {Tue, 19 Apr 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/NadipalliFLWYT11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NakahiraEFSM11,
author = {Kota Nakahira and
Fumiaki Endo and
Ryosuke Furuya and
Ken Suzuki and
Hideo Miura},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Minimization of the local residual stress in 3DICs by controlling
the structures and mechanical properties of 3D interconnections},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262997},
doi = {10.1109/3DIC.2012.6262997},
timestamp = {Sat, 30 Sep 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/NakahiraEFSM11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NakamuraKMMFO11,
author = {Tomoji Nakamura and
Hideki Kitada and
Yoriko Mizushima and
Nobuhide Maeda and
Koji Fujimoto and
Takayuki Ohba},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Comparative study of side-wall roughness effects on leakage currents
in through-silicon via interconnects},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262948},
doi = {10.1109/3DIC.2012.6262948},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/NakamuraKMMFO11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NakatsukaKKMNOZ11,
author = {Osamu Nakatsuka and
Hideki Kitada and
Young{-}Suk Kim and
Yoriko Mizushima and
Tomoji Nakamura and
Takayuki Ohba and
Shigeaki Zaima},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Characterization of local strain around trough silicon via interconnects
in wafer-on-wafer structures},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262971},
doi = {10.1109/3DIC.2012.6262971},
timestamp = {Sun, 25 Oct 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/NakatsukaKKMNOZ11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NakazawaSNKOTU11,
author = {Fumihiko Nakazawa and
Takeaki Shimanouchi and
Tadashi Nakatani and
Takashi Katsuki and
Hisao Okuda and
Osamu Toyoda and
Satoshi Ueda},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Effect of frequency in the 3D integration of a PZT-actuated {MEMS}
switch using a single crystal silicon asymmetric beam},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263007},
doi = {10.1109/3DIC.2012.6263007},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/NakazawaSNKOTU11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NoiaC11,
author = {Brandon Noia and
Krishnendu Chakrabarty},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Pre-bond testing of die logic and TSVs in high performance 3D-SICs},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263042},
doi = {10.1109/3DIC.2012.6263042},
timestamp = {Mon, 03 Jan 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/NoiaC11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NorikiLBFFK11,
author = {Akihiro Noriki and
Kang Wook Lee and
Jichoel Bea and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Fabrication tolerance evaluation of high efficient unidirectional
optical coupler for though silicon photonic via in optoelectronic
3D-LSI},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262957},
doi = {10.1109/3DIC.2012.6262957},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/NorikiLBFFK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/OharaLFTK11,
author = {Yuki Ohara and
Kang Wook Lee and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Novel detachable bonding process with wettability control of bonding
surface for versatile chip-level 3D integration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262950},
doi = {10.1109/3DIC.2012.6262950},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/OharaLFTK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/OizonoNOSSUI11,
author = {Yoshiaki Oizono and
Yoshitaka Nabeshima and
Takafumi Okumura and
Toshio Sudo and
Atsushi Sakai and
Shiro Uchiyama and
Hiroaki Ikeda},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {{PDN} impedance and {SSO} noise simulation of 3D system-in-package
with a widebus structure},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--2},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263028},
doi = {10.1109/3DIC.2012.6263028},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/OizonoNOSSUI11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/OkadaNUSNSMS11,
author = {Akiko Okada and
Masatsugu Nimura and
Naoko Unami and
Akitsu Shigetou and
Hirokazu Noma and
Katsuyuki Sakuma and
Jun Mizuno and
Shuichi Shoji},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Low temperature Au-Au bonding with {VUV/O3} treatment},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263015},
doi = {10.1109/3DIC.2012.6263015},
timestamp = {Sun, 02 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/OkadaNUSNSMS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/OlsonH11,
author = {Stephen Olson and
Klaus Hummler},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {{TSV} reveal etch for 3D integration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262987},
doi = {10.1109/3DIC.2012.6262987},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/OlsonH11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/PhommahaxayJVWBGSGMPBESBMB11,
author = {Alain Phommahaxay and
Anne Jourdain and
Greet Verbinnen and
Tobias Woitke and
Peter Bisson and
Markus Gabriel and
Walter Spiess and
Alice Guerrero and
Jeremy McCutcheon and
Rama Puligadda and
Pieter Bex and
Axel Van den Eede and
Bart Swinnen and
Gerald Beyer and
Andy Miller and
Eric Beyne},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Ultrathin wafer handling in 3D Stacked {IC} manufacturing combining
a novel ZoneBOND{\texttrademark} temporary bonding process with room
temperature peel debonding},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262943},
doi = {10.1109/3DIC.2012.6262943},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/PhommahaxayJVWBGSGMPBESBMB11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/PriyadarshiHCMCDF11,
author = {Shivam Priyadarshi and
Jianchen Hu and
Won Ha Choi and
Samson Melamed and
Xi Chen and
W. Rhett Davis and
Paul D. Franzon},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Pathfinder 3D: {A} flow for system-level design space exploration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--8},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262961},
doi = {10.1109/3DIC.2012.6262961},
timestamp = {Sun, 02 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/PriyadarshiHCMCDF11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/QuiringLOB11,
author = {Artur Quiring and
Marc Lindenberg and
Markus Olbrich and
Erich Barke},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {3D floorplanning considering vertically aligned rectilinear modules
using T\({}^{\mbox{{\({_\ast}\)}}}\)-tree},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263030},
doi = {10.1109/3DIC.2012.6263030},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/QuiringLOB11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/RosenbaumSK11,
author = {Elyse Rosenbaum and
Vrashank Shukla and
Min{-}Sun Keel},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {{ESD} protection networks for 3D integrated circuits},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--7},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262965},
doi = {10.1109/3DIC.2012.6262965},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/RosenbaumSK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SaitoMTSM11,
author = {Naoki Saito and
Naokazu Murata and
Kinji Tamakawa and
Ken Suzuki and
Hideo Miura},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Mechanical and electrical reliability of copper interconnections for
3DIC},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262998},
doi = {10.1109/3DIC.2012.6262998},
timestamp = {Sat, 30 Sep 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/SaitoMTSM11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SaitoWD11,
author = {Kazuta Saito and
Richard J. Webb and
Blake R. Dronen},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Advances of 3M{\texttrademark} wafer support system},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262994},
doi = {10.1109/3DIC.2012.6262994},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/SaitoWD11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SatoTSIMSKK11,
author = {Ryohei Sato and
Akihiro Tsukada and
Yukihiro Sato and
Yoshiharu Iwata and
Hidenori Murata and
Shigenobu Sekine and
Ryuji Kimura and
Keijiroh Kishi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Study on high performance and productivity of TSV's with new filling
method and alloy for advanced 3D-SiP},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262946},
doi = {10.1109/3DIC.2012.6262946},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/SatoTSIMSKK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SekarO11,
author = {Deepak C. Sekar and
Zvi Or{-}Bach},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Monolithic 3D-ICs with single crystal silicon layers},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--2},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262978},
doi = {10.1109/3DIC.2012.6262978},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/SekarO11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ShutoWIA11,
author = {Takanori Shuto and
Naoya Watanabe and
Akihiro Ikeda and
Tanemasa Asano},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Low-temperature bonding of {LSI} chips to {PEN} film using Au cone
bump for heterogeneous integration},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263012},
doi = {10.1109/3DIC.2012.6263012},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ShutoWIA11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SuarezBPCR11,
author = {Manuel Suarez and
V{\'{\i}}ctor M. Brea and
F. Pardo and
Ricardo Carmona{-}Gal{\'{a}}n and
{\'{A}}ngel Rodr{\'{\i}}guez{-}V{\'{a}}zquez},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A {CMOS-3D} reconfigurable architecture with in-pixel processing for
feature detectors},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--8},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263019},
doi = {10.1109/3DIC.2012.6263019},
timestamp = {Tue, 29 Jun 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/SuarezBPCR11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SugaK11,
author = {Tadatomo Suga and
Ryuichi Kondoh},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Low temperature bonding for 3D interconnects},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262942},
doi = {10.1109/3DIC.2012.6262942},
timestamp = {Mon, 29 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/SugaK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SyedCCK11,
author = {Uzair Shah Syed and
Krishnendu Chakrabarty and
Anshuman Chandra and
Rohit Kapur},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {3D-Scalable Adaptive Scan {(3D-SAS)}},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263043},
doi = {10.1109/3DIC.2012.6263043},
timestamp = {Mon, 03 Jan 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/SyedCCK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/TadaEKKG11,
author = {Jubee Tada and
Ryusuke Egawa and
Kazushige Kawai and
Hiroaki Kobayashi and
Gensuke Goto},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A middle-grain circuit partitioning strategy for 3-D integrated floating-point
multipliers},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263031},
doi = {10.1109/3DIC.2012.6263031},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/TadaEKKG11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ToyodaSHMSHMS11,
author = {Satoru Toyoda and
A. Shibata and
M. Harada and
Takahide Murayama and
Toshiyuki Sakuishi and
M. Hatanaka and
Yasuhiro Morikawa and
Koukou Suu},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {{TSV} process solution for 3D-IC},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262945},
doi = {10.1109/3DIC.2012.6262945},
timestamp = {Sun, 02 Aug 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ToyodaSHMSHMS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/VickGCT11,
author = {Erik Vick and
Scott H. Goodwin and
Garry Cunnigham and
Dorota Temple},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Vias-last process technology for thick 2.5D Si interposers},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262990},
doi = {10.1109/3DIC.2012.6262990},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/VickGCT11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/VollebregtICB11,
author = {Sten Vollebregt and
Ryoichi Ishihara and
Johan van der Cingel and
Kees Beenakker},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Low-temperature bottom-up integration of carbon nanotubes for vertical
interconnects in monolithic 3D integrated circuits},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262989},
doi = {10.1109/3DIC.2012.6262989},
timestamp = {Mon, 29 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/VollebregtICB11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/WangCF11,
author = {Ran Wang and
Gary Charles and
Paul D. Franzon},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Modeling and compare of through-silicon-via {(TSV)} in high frequency},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263048},
doi = {10.1109/3DIC.2012.6263048},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/WangCF11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/WangVL11,
author = {Xiaodong Wang and
Dilip P. Vasudevan and
Hsien{-}Hsin S. Lee},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Global Built-In Self-Repair for 3D memories with redundancy sharing
and parallel testing},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--8},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262967},
doi = {10.1109/3DIC.2012.6262967},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/WangVL11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/WangZNYW11,
author = {Yuhao Wang and
Chun Zhang and
Revanth Nadipalli and
Hao Yu and
Roshan Weerasekera},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Design exploration of 3D stacked non-volatile memory by conductive
bridge based crossbar},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--6},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263047},
doi = {10.1109/3DIC.2012.6263047},
timestamp = {Sat, 30 Sep 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/WangZNYW11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/WatanabeMAY11,
author = {Naoya Watanabe and
Takumi Miyazaki and
Masahiro Aoyagi and
Kazuhiro Yoshikawa},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Damage evaluation of wet-chemical silicon-wafer thinning process},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6262973},
doi = {10.1109/3DIC.2012.6262973},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/WatanabeMAY11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/WhippleM11,
author = {Thomas Whipple and
Thad McCracken},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Silicon interposer request-for-quote IC-package Co-design flow},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--7},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263044},
doi = {10.1109/3DIC.2012.6263044},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/WhippleM11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/WidiantoYOTH11,
author = {Widianto and
Hiroyuki Yotsuyanagi and
Akira Ono and
Masao Takagi and
Masaki Hashizume},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A built-in test circuit for open defects at interconnects between
dies in 3D ICs},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263041},
doi = {10.1109/3DIC.2012.6263041},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/WidiantoYOTH11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/YoonLK11,
author = {Taeshik Yoon and
Inhwa Lee and
Taek{-}Soo Kim},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Mechanical reliability of Cu/low-k interconnects and underfill},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263001},
doi = {10.1109/3DIC.2012.6263001},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/YoonLK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhangRCSCGLK11,
author = {Xiaowu Zhang and
Ranjan Rajoo and
F. X. Che and
C. S. Selvanayagam and
W. K. Choi and
Shan Gao and
Guo{-}Qiang Lo and
Dim{-}Lee Kwong},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A low stress bond pad design optimization of low temperature solder
interconnections on TSVs for {MEMS} applications},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--5},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263009},
doi = {10.1109/3DIC.2012.6263009},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ZhangRCSCGLK11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhangS11,
author = {Chao Zhang and
Guangyu Sun},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Fabrication cost analysis for 2D, 2.5D, and 3D {IC} designs},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263032},
doi = {10.1109/3DIC.2012.6263032},
timestamp = {Sat, 18 May 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ZhangS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhangS11a,
author = {Tao Zhang and
Guangyu Sun},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {Using {NEM} relay to improve 3DIC cost efficiency},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263040},
doi = {10.1109/3DIC.2012.6263040},
timestamp = {Fri, 24 Feb 2023 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/ZhangS11a.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhaoIAIS11,
author = {Qian Zhao and
Yusuke Iwai and
Motoki Amagasaki and
Masahiro Iida and
Toshinori Sueyoshi},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {A novel reconfigurable logic device base on 3D stack technology},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--4},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263022},
doi = {10.1109/3DIC.2012.6263022},
timestamp = {Wed, 18 Oct 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ZhaoIAIS11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhouMH11,
author = {Wei Zhou and
Max Guest and
Darcy Hart},
editor = {Mitsumasa Koyanagi and
Morihiro Kada},
title = {System level evaluation of Silicon imager based see-through Silicon
application},
booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
Osaka, Japan, January 31 - February 2, 2012},
pages = {1--2},
publisher = {{IEEE}},
year = {2011},
url = {https://doi.org/10.1109/3DIC.2012.6263020},
doi = {10.1109/3DIC.2012.6263020},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ZhouMH11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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