"Economizing TSV Resources in 3-D Network-on-Chip Design."

Ying Wang et al. (2015)

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DOI: 10.1109/TVLSI.2014.2311835

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type: Journal Article

metadata version: 2023-05-23

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Ying Wang, Yinhe Han, Lei Zhang, Binzhang Fu, Cheng Liu, Huawei Li, Xiaowei Li:
Economizing TSV Resources in 3-D Network-on-Chip Design. IEEE Trans. Very Large Scale Integr. Syst. 23(3): 493-506 (2015)

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