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"Postbond Test of Through-Silicon Vias With Resistive Open Defects."

Rosa Rodríguez-Montañés, Daniel Arumí, Joan Figueras (2019)

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DOI: 10.1109/TVLSI.2019.2925971

access: closed

type: Journal Article

metadata version: 2020-03-11

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  - journals/tvlsi/Rodriguez-Montanes19
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  - https://dblp.org/rec/journals/tvlsi/Rodriguez-Montanes19
Rosa Rodríguez-Montañés, Daniel Arumí, Joan Figueras:
Postbond Test of Through-Silicon Vias With Resistive Open Defects. IEEE Trans. Very Large Scale Integr. Syst. 27(11): 2596-2607 (2019)

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