"Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias."

Yung-Fa Chou, Ding-Ming Kwai, Cheng-Wen Wu (2011)

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DOI: 10.1109/TVLSI.2010.2051466

access: closed

type: Journal Article

metadata version: 2023-09-30

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Yung-Fa Chou, Ding-Ming Kwai, Cheng-Wen Wu:
Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias. IEEE Trans. Very Large Scale Integr. Syst. 19(8): 1346-1356 (2011)

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