"Effective congestion reduction for IC package substrate routing."

Shenghua Liu et al. (2010)

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DOI: 10.1145/1754405.1754412

access: closed

type: Journal Article

metadata version: 2018-11-06

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Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Robi Dutta, Xianlong Hong:
Effective congestion reduction for IC package substrate routing. ACM Trans. Design Autom. Electr. Syst. 15(3): 27:1-27:21 (2010)

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