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"Interlayer Cooling Network Design for High-Performance 3D ICs Using ..."

Hengliang Zhu et al. (2018)

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DOI: 10.1109/TCAD.2017.2731683

access: closed

type: Journal Article

metadata version: 2022-08-16

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Hengliang Zhu, Feng Hu, Hao Zhou, David Z. Pan, Dian Zhou, Xuan Zeng:
Interlayer Cooling Network Design for High-Performance 3D ICs Using Channel Patterning and Pruning. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37(4): 770-781 (2018)

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