"Hierarchical Partitioning-Based Interchip Redistribution Layer Routing for ..."

Haoyang Xu et al. (2025)

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DOI: 10.1109/TCAD.2025.3558145

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type: Journal Article

metadata version: 2025-11-24

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Haoyang Xu, Xing Huang, Zhen Zhuang, Zhiwen Yu, Bin Guo, Kai-Yuan Chao, Bei Yu, Tsung-Yi Ho, Martin D. F. Wong:
Hierarchical Partitioning-Based Interchip Redistribution Layer Routing for Fan-Out Wafer-Level Packaging. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 44(11): 4367-4380 (2025)

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