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"On Effective Through-Silicon Via Repair for 3-D-Stacked ICs."
Li Jiang, Qiang Xu, Bill Eklow (2013)
- Li Jiang, Qiang Xu, Bill Eklow:
On Effective Through-Silicon Via Repair for 3-D-Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(4): 559-571 (2013)
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