"Physically Justifiable Die-Level Modeling of Spatial Variation in View of ..."

Lerong Cheng et al. (2011)

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DOI: 10.1109/TCAD.2010.2089568

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type: Journal Article

metadata version: 2021-10-28

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Lerong Cheng, Puneet Gupta, Costas J. Spanos, Kun Qian, Lei He:
Physically Justifiable Die-Level Modeling of Spatial Variation in View of Systematic Across Wafer Variability. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 30(3): 388-401 (2011)

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