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"ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for ..."

Hyunsu Chae et al. (2024)

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DOI: 10.1109/TCAD.2023.3305934

access: closed

type: Journal Article

metadata version: 2024-01-13

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Hyunsu Chae, Keren Zhu, Bhyrav Mutnury, Douglas Wallace, Douglas Winterberg, Daniel De Araujo, Jay Reddy, Adam R. Klivans, David Z. Pan:
ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(1): 2-15 (2024)

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