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"Hier-3D: A Methodology for Physical Hierarchy Exploration of 3-D ICs."

Nesara Eranna Bethur et al. (2024)

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DOI: 10.1109/TCAD.2023.3342753

access: closed

type: Journal Article

metadata version: 2024-07-19

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  - journals/tcad/BethurABOCMKCRBL24
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  - https://dblp.org/rec/journals/tcad/BethurABOCMKCRBL24
Nesara Eranna Bethur, Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim:
Hier-3D: A Methodology for Physical Hierarchy Exploration of 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(7): 1957-1970 (2024)

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