"Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using ..."

Dong Liu et al. (2019)

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DOI: 10.1109/TASE.2018.2848635

access: closed

type: Journal Article

metadata version: 2020-04-02

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Dong Liu, Chek Sing Teo, Wenyu Liang, Kok Kiong Tan:
Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle. IEEE Trans Autom. Sci. Eng. 16(2): 668-677 (2019)

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