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"Reliability assessment for solders with a stress buffer layer using ball ..."

Ming-Chih Yew, Chan-Yen Chou, Kuo-Ning Chiang (2007)

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DOI: 10.1016/J.MICROREL.2007.07.043

access: closed

type: Journal Article

metadata version: 2022-10-02

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Ming-Chih Yew, Chan-Yen Chou, Kuo-Ning Chiang:
Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis. Microelectron. Reliab. 47(9-11): 1658-1662 (2007)

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