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"Underfill of flip chip on organic substrate: viscosity, surface tension, ..."

Jinlin Wang (2002)

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DOI: 10.1016/S0026-2714(01)00231-1

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jinlin Wang:
Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle. Microelectron. Reliab. 42(2): 293-299 (2002)

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