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"True constant temperature MTF test system for the characterization of ..."
Graziella Scandurra et al. (2002)
- Graziella Scandurra
, Carmine Ciofi, Calogero Pace, F. Speroni, F. Alagi:
True constant temperature MTF test system for the characterization of electromigration of thick Cu interconnection lines. Microelectron. Reliab. 42(9-11): 1347-1351 (2002)
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