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"Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in ..."

Masaki Omiya et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.12.009

access: closed

type: Journal Article

metadata version: 2021-10-14

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  - https://dblp.org/rec/journals/mr/OmiyaKSKCSNSNSN13
Masaki Omiya, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Chuantong Chen, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo:
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. Microelectron. Reliab. 53(4): 612-621 (2013)

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