"Development of gold to gold interconnection flip chip bonding for chip on ..."

C. F. Luk, Y. C. Chan, K. C. Hung (2002)

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DOI: 10.1016/S0026-2714(01)00256-6

access: closed

type: Journal Article

metadata version: 2020-02-22

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C. F. Luk, Y. C. Chan, K. C. Hung:
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. Microelectron. Reliab. 42(3): 381-389 (2002)

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