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"Dynamic responses and solder joint reliability under board level drop test."
Jing-en Luan et al. (2007)
- Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim
, Zhaowei Zhong:
Dynamic responses and solder joint reliability under board level drop test. Microelectron. Reliab. 47(2-3): 450-460 (2007)
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