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"The optimization design of bump interconnections in flip chip packages ..."

De-Shin Liu, Chin-Yu Ni (2002)

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DOI: 10.1016/S0026-2714(02)00262-7

access: closed

type: Journal Article

metadata version: 2020-02-22

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De-Shin Liu, Chin-Yu Ni:
The optimization design of bump interconnections in flip chip packages from the electrical standpoint. Microelectron. Reliab. 42(12): 1893-1901 (2002)

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