"Analysis of thermal stresses in metal interconnects with multilevel ..."

M. S. Kilijanski, Yu-Lin Shen (2002)

> Home

Details and statistics

DOI: 10.1016/S0026-2714(01)00239-6

access: closed

type: Journal Article

metadata version: 2022-06-17

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/KilijanskiS02
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/KilijanskiS02
M. S. Kilijanski, Yu-Lin Shen:
Analysis of thermal stresses in metal interconnects with multilevel structures. Microelectron. Reliab. 42(2): 259-264 (2002)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.