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"Cohesive zone modeling for structural integrity analysis of IC interconnects."

B. A. E. van Hal et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.08.017

access: closed

type: Journal Article

metadata version: 2023-09-30

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B. A. E. van Hal, Ron H. J. Peerlings, Marc G. D. Geers, Olaf van der Sluis:
Cohesive zone modeling for structural integrity analysis of IC interconnects. Microelectron. Reliab. 47(8): 1251-1261 (2007)

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