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"Effects of bonding parameters on the reliability performance of ..."

Y. C. Chan, D. Y. Luk (2002)

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DOI: 10.1016/S0026-2714(02)00079-3

access: closed

type: Journal Article

metadata version: 2020-02-22

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Y. C. Chan, D. Y. Luk:
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. Microelectron. Reliab. 42(8): 1185-1194 (2002)

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