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"Impact of component placement in solder joint reliability."

T. Alander et al. (2002)

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DOI: 10.1016/S0026-2714(01)00217-7

access: closed

type: Journal Article

metadata version: 2023-09-20

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  - https://dblp.org/rec/journals/mr/AlanderNHR02
T. Alander, S. Nurmi, Pekka Heino, Eero Ristolainen:
Impact of component placement in solder joint reliability. Microelectron. Reliab. 42(3): 399-406 (2002)

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