Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Reliability study of the electroless Ni-P layer against solder alloy."

M. O. Alam, Yan Cheong Chan, K. C. Hung (2002)

> Home

Details and statistics

DOI: 10.1016/S0026-2714(02)00068-9

access: closed

type: Journal Article

metadata version: 2022-07-20

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/AlamCH02
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/AlamCH02
M. O. Alam, Yan Cheong Chan, K. C. Hung:
Reliability study of the electroless Ni-P layer against solder alloy. Microelectron. Reliab. 42(7): 1065-1073 (2002)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.