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"Enhancement of adhesion strength of Cu layer with low dielectric constant ..."
Grace Wang et al. (2005)
- Grace Wang, S. Balakumar, S. C. Hwee, Rakesh Kumar, T. Hara:
Enhancement of adhesion strength of Cu layer with low dielectric constant SiC: H liners in Cu interconnects. Microelectron. J. 36(8): 749-753 (2005)
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