Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Influence of transient flow and solder bump resistance on underfill process."

J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom (2005)

> Home

Details and statistics

DOI: 10.1016/J.MEJO.2005.05.022

access: closed

type: Journal Article

metadata version: 2023-03-21

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mj/WanZB05
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mj/WanZB05
J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom:
Influence of transient flow and solder bump resistance on underfill process. Microelectron. J. 36(8): 687-693 (2005)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.