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"Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement."

Krit Athikulwongse, Mongkol Ekpanyapong, Sung Kyu Lim (2014)

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DOI: 10.1109/TVLSI.2013.2285593

access: closed

type: Journal Article

metadata version: 2022-10-02

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  - https://dblp.org/rec/journals/tvlsi/AthikulwongseEL14
Krit Athikulwongse, Mongkol Ekpanyapong, Sung Kyu Lim:
Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement. IEEE Trans. Very Large Scale Integr. Syst. 22(10): 2145-2155 (2014)

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