"An Ising model mapping to solve rectangle packing problem."

Kotaro Terada et al. (2018)

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DOI: 10.1109/VLSI-DAT.2018.8373233

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type: Conference or Workshop Paper

metadata version: 2020-10-25

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Kotaro Terada, Daisuke Oku, Sho Kanamaru, Shu Tanaka, Masato Hayashi, Masanao Yamaoka, Masao Yanagisawa, Nozomu Togawa:
An Ising model mapping to solve rectangle packing problem. VLSI-DAT 2018: 1-4

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