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"TestDNA: Novel Wafer Defect Signature for Diagnosis and Yield Learning."

Andrew Yi-Ann Huang et al. (2019)

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DOI: 10.1109/ITC44170.2019.9000166

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  - conf/itc/HuangLTCWJCL19
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  - https://dblp.org/rec/conf/itc/HuangLTCWJCL19
Andrew Yi-Ann Huang, Katherine Shu-Min Li, Cheng-Yen Tsai, Ken Chau-Cheung Cheng, Sying-Jyan Wang, Xu-Hao Jiang, Leon Chou, Chen-Shiun Lee:
TestDNA: Novel Wafer Defect Signature for Diagnosis and Yield Learning. ITC 2019: 1-6

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