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"W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for ..."

Hayoung Lee et al. (2020)

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DOI: 10.1109/ITC-ASIA51099.2020.00028

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-27

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  - conf/itc-asia/LeeHKK20
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Hayoung Lee, Donghyun Han, Hogyeong Kim, Sungho Kang:
W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for Cost Reduction. ITC-Asia 2020: 94-99

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