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"11.1 AMD InstinctTM MI300 Series Modular Chiplet Package - HPC and AI ..."

Alan Smith et al. (2024)

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DOI: 10.1109/ISSCC49657.2024.10454441

access: closed

type: Conference or Workshop Paper

metadata version: 2024-03-19

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Alan Smith, Eric Chapman, Chintan Patel, Raja Swaminathan, John J. Wuu, Tyrone Huang, Wonjun Jung, Alexander Kaganov, Hugh McIntyre, Ramon Mangaser:
11.1 AMD InstinctTM MI300 Series Modular Chiplet Package - HPC and AI Accelerator for Exa-Class Systems. ISSCC 2024: 490-492

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