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"Bonding-pad-oriented on-chip ESD protection structures for ICs."

Haigang Feng et al. (2003)

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DOI: 10.1109/ISCAS.2003.1205670

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-14

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  - conf/iscas/FengZCWGXW03
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  - https://dblp.org/rec/conf/iscas/FengZCWGXW03
Haigang Feng, Rouying Zhan, Guang Chen, Qiong Wu, Xiaokang Guan, Haolu Xie, Albert Z. Wang:
Bonding-pad-oriented on-chip ESD protection structures for ICs. ISCAS (1) 2003: 741-744

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