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"Impacts of 3-D integration processes on device reliabilities in thinned ..."
Kang Wook Lee et al. (2015)
- Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM. IRPS 2015: 4
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