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"Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability."

Mukta G. Farooq et al. (2015)

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DOI: 10.1109/IRPS.2015.7112732

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-08

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  dblp key:
  - conf/irps/FarooqRCPGKCLOL15
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  - https://dblp.org/rec/conf/irps/FarooqRCPGKCLOL15
Mukta G. Farooq, Giuseppe La Rosa, Fen Chen, Prakash Periasamy, Troy L. Graves-abe, Chandrasekharan Kothandaraman, C. Collins, W. Landers, J. Oakley, J. Liu, John Safran, S. Ghosh, S. Mittl, D. Ioannou, Carole Graas, Daniel Berger, Subramanian S. Iyer:
Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability. IRPS 2015: 4

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