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"Three-dimensional impedance engineering for mixed-signal system-on-chip ..."

Kyuchul Chong et al. (2005)

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DOI: 10.1109/CICC.2005.1568757

access: closed

type: Conference or Workshop Paper

metadata version: 2019-06-02

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Kyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Frank Chang, Ya-Hong Xie:
Three-dimensional impedance engineering for mixed-signal system-on-chip applications. CICC 2005: 663-666

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