"Low temperature CMOS compatible Cu-Cu thermo-compression bonding with ..."

Asisa Kumar Panigrahi et al. (2016)

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DOI: 10.1109/3DIC.2016.7970019

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh:
Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration. 3DIC 2016: 1-4

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