BibTeX record journals/mr/ZhengLLWH03

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@article{DBLP:journals/mr/ZhengLLWH03,
  author       = {Po{-}Jen Zheng and
                  J. Z. Lee and
                  K. H. Liu and
                  J. D. Wu and
                  S. C. Hung},
  title        = {Solder joint reliability of {TFBGA} assemblies with fresh and reworked
                  solder balls},
  journal      = {Microelectron. Reliab.},
  volume       = {43},
  number       = {6},
  pages        = {925--934},
  year         = {2003},
  url          = {https://doi.org/10.1016/S0026-2714(03)00072-6},
  doi          = {10.1016/S0026-2714(03)00072-6},
  timestamp    = {Sat, 22 Feb 2020 19:27:01 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZhengLLWH03.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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