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"Solder joint reliability of TFBGA assemblies with fresh and reworked ..."

Po-Jen Zheng et al. (2003)

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DOI: 10.1016/S0026-2714(03)00072-6

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/ZhengLLWH03
Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung:
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. Microelectron. Reliab. 43(6): 925-934 (2003)

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