Masud H. Chowdhury

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Abdul Hamid Bin Yousuf

> Home > Persons > Masud H. Chowdhury

Publications

2018
[j21]
- view
  authority control:
- export record
  dblp key:
  - journals/jolpe/AshenafiYC18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/jolpe/AshenafiYC18
Emeshaw Ashenafi, Abdul Hamid Bin Yousuf, Masud H. Chowdhury:
Investigation and Optimization of Spiral Inductor Design for On-Chip Buck Converter. J. Low Power Electron. 14(1): 57-66 (2018)
2017
[c82]
- view
  authority control:
- export record
  dblp key:
  - conf/iscas/YousufHC17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/iscas/YousufHC17
Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury:
Impacts of different shapes of through-silicon-via core on 3D IC performance. ISCAS 2017: 1-4
2015
[c68]
- view
  authority control:
- export record
  dblp key:
  - conf/iscas/YousufHC15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/iscas/YousufHC15
Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury:
Performance analysis of through silicon via (TSV) and through glass via (TGV) for different materials. ISCAS 2015: 1957-1960
[c60]
- view
  authority control:
- export record
  dblp key:
  - conf/mwscas/HossainSYEC15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/mwscas/HossainSYEC15
Munem Hossain, Muhammad Sanaullah, Abdul Hamid Bin Yousuf, Azzedin Es-Saki, Masud H. Chowdhury:
Analytical analysis of the contact resistance (Rc) of metal-MoS2 interface. MWSCAS 2015: 1-4
2013
[c48]
- view
  authority control:
- export record
  dblp key:
  - conf/3dic/HossainHYC13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/HossainHYC13
Nahid M. Hossain, MunEm Hossain, Abdul Hamid Bin Yousuf, Masud H. Chowdhury:
Thermal aware Graphene based Through Silicon Via design for 3D IC. 3DIC 2013: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.