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2020 – today
- 2022
[j2]Patrick Steglich
, Giulia Lecci, Andreas Mai:
Surface Plasmon Resonance (SPR) Spectroscopy and Photonic Integrated Circuit (PIC) Biosensors: A Comparative Review. Sensors 22(8): 2901 (2022)- [c6]Mindaugas Lukosius, Rasuole Lukose, Marco Lisker, Giuseppe Luongo, M. Elviretti, Andreas Mai, Christian Wenger:
Graphene Research in 200 mm CMOS Pilot Line. MIPRO 2022: 113-117
2010 – 2019
- 2019
- [c5]Andreas Mai, Siegfried Bondarenko, Christian Mai, Patrick Steglich:
Photonic thermal sensor integration towards electronic-photonic-IC technologies. ESSDERC 2019: 254-257 - [c4]Andreas Mai, Philipp Scholz, Gerhard G. Fischer, Friedel Gerfers:
High Performance Electronic Design Education - from Technology towards High Frequency Chip Sets. FIE 2019: 1-8 - 2017
- [c3]Mesut Inac, Grzegorz Lupina, Matthias Wietstruck, Marco Lisker, Mirko Fraschke, Andreas Mai, Fabio Coccetti, Mehmet Kaynak:
200 mm Wafer level graphene transfer by wafer bonding technique. ESSDERC 2017: 216-219 - 2015
- [c2]Andreas Mai, Alexander Fox:
Reliability aspects of TiSi-Schottky barrier diodes in a SiGe BiCMOS technology. ESSDERC 2015: 234-237 - 2012
- [c1]Andreas Mai, Holger Rücker:
Complementary RF-LDMOS transistors realized with standard CMOS implantations. ESSDERC 2012: 181-184 - 2010
- [j1]Holger Rücker, Bernd Heinemann, Wolfgang Winkler, Rainer Barth, Johannes Borngräber, Jürgen Drews, Gerhard G. Fischer, Alexander Fox, Thomas Grabolla, Ulrich Haak, Dieter Knoll, Falk Korndörfer, Andreas Mai, Steffen Marschmeyer, Peter Schley, Detlef Schmidt, J. Schmidt, Markus Andreas Schubert, K. Schulz, Bernd Tillack, Dirk Wolansky, Yuji Yamamoto:
A 0.13 µm SiGe BiCMOS Technology Featuring fT/fmax of 240/330 GHz and Gate Delays Below 3 ps. IEEE J. Solid State Circuits 45(9): 1678-1686 (2010)
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