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ORCIDBin Li 0026
Person information
- affiliation: Huazhong University of Science and Technology, State Key Laboratory of Digital Manufacturing Equipment and Technology, Wuhan, China
- affiliation (PhD 2006): Huazhong University of Science and Technology, School of Mechanical Science and Engineering, Wuhan, China
Other persons with the same name
- Bin Li — disambiguation page
- Bin Li 0001 — Chinese Academy of Sciences, Shenyang Institute of Automation, State Key Laboratory of Robotics, China
- Bin Li 0002
![[0000-0002-1998-819X]](https://dblp.uni-trier.de/img/orcid-mark.12x12.png "0000-0002-1998-819X")
— Beijing University of Posts and Telecommunications, School of Information and Communication Engineering, China - Bin Li 0003 — City University of Hong Kong, Department of Linguistics and Translation, Hong Kong (and 1 more)
- Bin Li 0004 — Northeast Electric Power University, School of Information Engineering, Jilin, China (and 1 more)
- Bin Li 0005 — Sichuan University, School of Electrical Engineering and Information, Chengdu, China (and 2 more)
- Bin Li 0006 — Yangzhou University, School of Information Engineering, China (and 2 more)
- Bin Li 0007 — South China University of Technology, School of Microelectronics, Guangzhou, China (and 1 more)
- Bin Li 0008 — Louisiana State University, Department of Experimental Statistics, Baton Rouge, LA, USA (and 1 more)
- Bin Li 0009 — Tianjin University of Technology, School of Mechanical Engineering, Tianjin Key Laboratory for Advanced Mechatronic System Design and Intelligent Control, Tianjin, China
- Bin Li 0010 — Nanjing University of Information Science and Technology, School of Computer and Software, China (and 3 more)
- Bin Li 0011 — Shenzhen University, College of Information Engineering, Guangdong Key Laboratory of Intelligent Information Processing, Shenzhen Key Laboratory of Media Security, Shenzhen, China (and 2 more)
- Bin Li 0012 — Microsoft Research Asia, Beijing, China (and 1 more)
- Bin Li 0013 — Huawei Technologies, Communications Technology Research Laboratory, Shenzhen, China (and 4 more)
- Bin Li 0014 — Pennsylvania State University, School of Electrical Engineering and Computer Science, State College, PA, USA (and 3 more)
- Bin Li 0015 — Fudan University, School of Computer Science, Shanghai, China (and 3 more)
- Bin Li 0016 — Chinese Academy of Sciences, Institute of Remote Sensing and Digital Earth, Beijing, China
- Bin Li 0017 — Northwestern Polytechnical University, Department of Communication Engineering, Xi'an, China (and 1 more)
- Bin Li 0018 — Intel Labs, Hillsboro, OR, USA (and 1 more)
- Bin Li 0019 — Shanghai University, School of Mechanical and Electrical Engineering and Automation, China
- Bin Li 0020 — University of Maryland, College Park, MD, USA
- Bin Li 0021 — University of Surrey, Guildford, UK
- Bin Li 0022 — Nanjing University of Posts and Telecommunications, School of Telecommunications and Information Engineering, Nanjing, China (and 1 more)
- Bin Li 0023 — PLA Information Engineering University, State Key Laboratory of Mathematical Engineering and Advanced Computing, Zhengzhou, China
- Bin Li 0024 — South China University of Technology, School of Automation Science and Engineering, Guangzhou, China
- Bin Li 0025 — University of Science and Technology of China, School of Information Science and Technology, Hefei, China (and 3 more)
- Bin Li 0027 — Wuhan University, Economics and Management School, Wuhan, China (and 1 more)
- Bin Li 0028 — Tianjin University, School of Electrical Engineering and Automation, MoE Key Laboratory of Smart Grid, China
- Bin Li 0029 — University of Waterloo, Department of Statistics and Actuarial Science, ON, Canada (and 1 more)
- Bin Li 0030 — National University of Defense Technology, College of Computer, Science and Technology on Parallel and Distributed Processing Laboratory, Changsha, China
- Bin Li 0031 — North China Electric Power University, School of Electrical and Electronic Engineering, Beijing, China (and 1 more)
- Bin Li 0032 — Tianjin University, School of Electrical and Information Engineering, China
- Bin Li 0033 — University of Hong Kong, Department of Electrical and Electronic Engineering, Hong Kong
- Bin Li 0034 — Fujian University of Technology, School of Mechanical & Automotive Engineering, Fuzhou, China (and 2 more)
- Bin Li 0035 — University of Electronic Science and Technology of China, Chengdu, China
- Bin Li 0036 — China Motion Telecom, China (and 1 more)
- Bin Li 0037 — Beijing Institute of Technology, School of Aerospace Engineering, Beijing Key Laboratory of UAV Autonomous Control, Beijing, China
- Bin Li 0038 — Alibaba Group, Hangzhou, China (and 1 more)
- Bin Li 0039 — University of Arkansas, College of Engineering, Fayetteville, AR, USA
- Bin Li 0040 — Zhengzhou University, College of Water Conservancy and Environmental Engineering, China
- Bin Li 0041 — Hunan City University, College of Mechanic and Electrical Engineering, Yiyang, China
- Bin Li 0042 — Qilu University of Technology (Shandong Academy of Sciences), School of Mathematics and Statistics, Jinan, China (and 4 more)
- Bin Li 0043 — Guangxi University, Guangxi Key Laboratory of Power System Optimization and Energy Technology, Nanning, China
- Bin Li 0044 — Xiangtan University, School of Information Engineering, MoE Key Laboratory of Intelligent Computing and Information Processing, China
- Bin Li 0045 — Beijing Research Center of Intelligent Equipment for Agriculture, Beijing, China (and 2 more)
- Bin Li 0046 — Shanxi Key Laboratory of Integrated and Intelligent Navigation, Xi'an, China (and 1 more)
- Bin Li 0047 — Sun Yat-sen University Cancer Center, State Key Laboratory of Oncology in South China, Guangzhou, China (and 2 more)
- Bin Li 0048 — Beijing Institute of Technology, Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, China (and 1 more)
- Bin Li 0050 — Southern Medical University, School of Biomedical Engineering, Department of Mathematical Physics, Guangzhou, China
- Bin Li 0051 — Northwest University, School of Information Science and Technology, Xi'an, China (and 1 more)
- Bin Li 0052 — Nanjing Normal University, School of Chinese Language and Literature, Nanjing, China (and 2 more)
- Bin Li 0053 — Beijing Academy of Sciences and Technology, Beijing Institute of New Technology Applications, Beijing, China (and 2 more)
- Bin Li 0054 — Nanjing University, Department of Computer Science and Technology, State Key Laboratory for Novel Software Technology, Nanjing, China
- Bin Li 0055 — Hebei University of Technology, School of Mechanical Engineering, Tianjin, China
- Bin Li 0056 — Shantou Institute of Ultrasonic Instruments Co., Ltd., Shantou, China
- Bin Li 0057 — University of Shanghai for Science and Technology, School of Optical Electrical and Computer Engineering, Shanghai, China
- Bin Li 0058 — Chang'an University, School of Automobile, Xi'an, China
- Bin Li 0059 — Anhui University of Science and Technology, School of Safety Science and Engineering, Huainan, China
- Bin Li 0060 — Sun Yat-sen University, State Key Laboratory for Biocontrol, Key Laboratory of Gene Engineering, Guangzhou, China
- Bin Li 0061 — Central Michigan University, Department of Geography, Mount Pleasant, MI, USA
- Bin Li 0062 — China Academy of Space Technology, Xi'an, China
- Bin Li 0063 — University of Houston, Bauer College of Business, Houston, TX, USA
- Bin Li 0064 — University of Wisconsin-Madison, Department of Biomedical Engineering, Laboratory for Optical and Computational Instrumentation, Madison, WI, USA
- Bin Li 0065 — Northwestern Polytechnical University, School of Marine Science and Technology, Xi'an, China
- Bin Li 0066 — Northeastern University, College of Information Science and Engineering, State Key Laboratory of Synthetical Automation for Process Industries, Shenyang, China
- Bin Li 0068 — Communication University of China, School of Information and Communication Engineering, Beijing, China
- Bin Li 0069 — Sun Yat-sen University, School of Chemical Engineering and Technology, Zhuhai, China
- Bin Li 0070 — Anhui Open University, School of Information Engineering, Hefei, China
- Bin Li 0071 — Wuhan University, School of Geodesy and Geomatics, Wuhan, China
- Bin Li 0072 — University of Alberta, Department of Biological Sciences, Edmonton, Canada
- Bin Li 0073 — South China University of Technology, School of Software Engineering, Guangzhou, China
- Bin Li 0074 — Southeast University, School of Mathematics, Nanjing, China (and 2 more)
- Bin Li 0075 — Hunan Institute of Science and Technology, School of Information Science and Engineering, Hunan Engineering Technology Research Center for 3D Reconstruction and Intelligent Application, Yueyang, China
- Bin Li 0076 — Central South University, School of Mathematics and Statistics, Changsha, China (and 1 more)
- Bin Li 0077 — Zhejiang University, College of Mechanical Engineering, Key Laboratory of 3D Printing Process and Equipment of Zhejiang Province / State Key Laboratory of Fluid Power and Mechatronic Systems, Hangzhou, China
- Bin Li 0078 — University of Science and Technology Beijing, Institute of Artificial Intelligence, School of Automation and Electrical Engineering, Beijing, China
- Bin Li 0079 — University of Science and Technology Beijing, National Center for Materials Service Safety, Beijing, China
- Bin Li 0080 — Beihang University, School of Automation Science and Electrical Engineering, Beijing, China
- Bin Li 0081 — Liaoning Technical University, Faulty of Electrical and Control Engineering, Huludao, China
- Bin Li 0082 — Chinese University of Hong Kong, T stone Robotics Institute, Department of Mechanical and Automation Engineering, Hong Kong
- Bin Li 0083 — Hunan University, College of Electrical and Information Engineering, Changsha, China
- Bin Li 0084 — Tianjin AiForward Science and Technology Co., Ltd., China (and 2 more)
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Journal Articles
- 2024
[j17]Shuanlong Niu, Yaru Peng, Bin Li, Yuanhong Qiu, Tongzhi Niu, Weifeng Li:
A novel deep learning motivated data augmentation system based on defect segmentation requirements. J. Intell. Manuf. 35(2): 687-701 (2024)- [j16]Biao Chen, Tongzhi Niu, Wenyong Yu, Ruoqi Zhang, Zhenrong Wang, Bin Li:
A-Net: An A-Shape Lightweight Neural Network for Real-Time Surface Defect Segmentation. IEEE Trans. Instrum. Meas. 73: 1-14 (2024) - 2023
- [j15]Weifeng Li, Bin Li, Shuanlong Niu, Zhenrong Wang, Baohui Liu, Tongzhi Niu:
Selecting informative data for defect segmentation from imbalanced datasets via active learning. Adv. Eng. Informatics 56: 101933 (2023) - [j14]Caihua Hao, Xinyong Mao, Tao Ma, Songping He, Bin Li, Hongqi Liu, Fangyu Peng, Lei Zhang:
A novel deep learning method with partly explainable: Intelligent milling tool wear prediction model based on transformer informed physics. Adv. Eng. Informatics 57: 102106 (2023) - [j13]Shuanlong Niu, Yaru Peng, Bin Li, Xinggang Wang:
A transformed-feature-space data augmentation method for defect segmentation. Comput. Ind. 147: 103860 (2023) - [j12]Tongzhi Niu, Zhiyu Xie, Jie Zhang, Lixin Tang, Bin Li, Hao Wang:
A generalized well neural network for surface defect segmentation in Optical Communication Devices via Template-Testing comparison. Comput. Ind. 151: 103978 (2023) - 2022
- [j11]Shuanlong Niu, Bin Li, Xinggang Wang, Songping He, Yaru Peng:
Defect attention template generation cycleGAN for weakly supervised surface defect segmentation. Pattern Recognit. 123: 108396 (2022) - [j10]Yuanhong Qiu, Shuanlong Niu, Tongzhi Niu, Weifeng Li, Bin Li:
Joint-Prior-Based Uneven Illumination Image Enhancement for Surface Defect Detection. Symmetry 14(7): 1473 (2022) - [j9]Shuanlong Niu, Bin Li, Xinggang Wang, Yaru Peng:
Region- and Strength-Controllable GAN for Defect Generation and Segmentation in Industrial Images. IEEE Trans. Ind. Informatics 18(7): 4531-4541 (2022) - 2020
- [j8]Yuanhong Qiu, Lixin Tang, Bin Li, Suanlong Niu, Tongzhi Niu:
Uneven Illumination Surface Defects Inspection Based on Saliency Detection and Intrinsic Image Decomposition. IEEE Access 8: 190663-190676 (2020) - [j7]Shuanlong Niu, Bin Li, Xinggang Wang, Hui Lin:
Defect Image Sample Generation With GAN for Improving Defect Recognition. IEEE Trans Autom. Sci. Eng. 17(3): 1611-1622 (2020) - [j6]Chengming Shi, Bo Luo, Songping He, Kai Li, Hongqi Liu, Bin Li:
Tool Wear Prediction via Multidimensional Stacked Sparse Autoencoders With Feature Fusion. IEEE Trans. Ind. Informatics 16(8): 5150-5159 (2020) - 2019
- [j5]Hui Lin, Bin Li, Xinggang Wang, Yufeng Shu, Shuanglong Niu:
Automated defect inspection of LED chip using deep convolutional neural network. J. Intell. Manuf. 30(6): 2525-2534 (2019) - [j4]Yufeng Shu, Yu Huang, Bin Li:
Design of deep learning accelerated algorithm for online recognition of industrial products defects. Neural Comput. Appl. 31(9): 4527-4540 (2019) - [j3]Bo Luo, Haoting Wang, Hongqi Liu, Bin Li, Fangyu Peng:
Early Fault Detection of Machine Tools Based on Deep Learning and Dynamic Identification. IEEE Trans. Ind. Electron. 66(1): 509-518 (2019) - [j2]Chengming Shi, George Panoutsos, Bo Luo, Hongqi Liu, Bin Li, Xu Lin:
Using Multiple-Feature-Spaces-Based Deep Learning for Tool Condition Monitoring in Ultraprecision Manufacturing. IEEE Trans. Ind. Electron. 66(5): 3794-3803 (2019) - 2016
- [j1]Lei Wu, Zhijuan Zhu, Huai Cao, Bin Li:
Influence of information overload on operator's user experience of human-machine interface in LED manufacturing systems. Cogn. Technol. Work. 18(1): 161-173 (2016)
Conference and Workshop Papers
- 2023
- [c9]Tongzhi Niu, Biao Chen, Zhenrong Wang, Ruoqi Zhang, Bin Li:
Background-Adaptive Surface Defect Detection Neural Networks via Positive Samples. IECON 2023: 1-9 - 2019
- [c8]Shuanlong Niu, Hui Lin, Tongzhi Niu, Bin Li, Xinggang Wang:
DefectGAN: Weakly-Supervised Defect Detection using Generative Adversarial Network. CASE 2019: 127-132 - 2016
- [c7]Lei Wu, Juan Li, Tian Lei, Bin Li:
EID vs UCD: A Comparative Study on User Interface Design in Complex Electronics Manufacturing Systems. HCI (6) 2016: 354-362 - 2015
- [c6]Lei Wu, Tian Lei, Juan Li, Bin Li:
Skeuomorphism and Flat Design: Evaluating Users' Emotion Experience in Car Navigation Interface Design. HCI (18) 2015: 567-575 - 2014
- [c5]Xianyin Duan, Fangyu Peng, Rong Yan, Zerun Zhu, Bin Li:
Experimental Study on Cutter Deflection in Multi-axis NC Machining. ICIRA (1) 2014: 99-109 - 2013
- [c4]Hui Cai, Bin Li, Xinyong Mao, Bo Luo, Fangyu Peng:
A Complete Methodology for Estimating Dynamics of the Heavy Machine Tool Structure. ICIRA (2) 2013: 513-524 - 2008
- [c3]Fangyu Peng, Xubin Chen, Yong Zhou, Li Li, Bin Li:
Look-Ahead Scheme for High Speed Consecutive Micro Line Interpolation Based on Dynamics of Machine Tool. ICIRA (2) 2008: 743-753 - [c2]Yong Zhou, Fangyu Peng, Bin Li:
Adaptive Notch Filter Control for the Torsion Vibration in Lead-Screw Feed Drive System Based on Neural Network. ICIRA (2) 2008: 803-812 - [c1]Rong Yan, Fangyu Peng, Bin Li:
A Method of General Stiffness Modeling for Multi-axis Machine Tool. ICIRA (2) 2008: 1013-1021
Informal and Other Publications
- 2023
- [i3]Tongzhi Niu, Bin Li, Kai Li, Yufeng Lin, Yuwei Li, Weifeng Li, Zhenrong Wang:
Learning Trustworthy Model from Noisy Labels based on Rough Set for Surface Defect Detection. CoRR abs/2301.10441 (2023) - [i2]Zhenrong Wang, Bin Li, Weifeng Li, Shuanlong Niu, Wang Miao, Tongzhi Niu:
NAS-ASDet: An Adaptive Design Method for Surface Defect Detection Network using Neural Architecture Search. CoRR abs/2311.10952 (2023) - 2022
- [i1]Wei Luo, Tongzhi Niu, Lixin Tang, Wenyong Yu, Bin Li:
Clear Memory-Augmented Auto-Encoder for Surface Defect Detection. CoRR abs/2208.03879 (2022)
Coauthor Index
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