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David A. Dillard

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2000 – 2009

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2002
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Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard:
Effect of substrate flexibility on solder joint reliability. Microelectron. Reliab. 42(12): 1883-1891 (2002)
2001
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Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard:
Stacked solder bumping technology for improved solder joint reliability. Microelectron. Reliab. 41(12): 1979-1992 (2001)

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