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Shu-Ting Hsieh

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Conference and Workshop Papers

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2022
[c1]
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Zhong-Jie Hong, Demin Liu, Shu-Ting Hsieh, Han-Wen Hu, Ming-Wei Weng, Chih-I Cho, Jui-Han Liu, Kuan-Neng Chen:
Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging. VLSI Technology and Circuits 2022: 387-388

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