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"Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for ..."

Zhong-Jie Hong et al. (2022)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830175

access: closed

type: Conference or Workshop Paper

metadata version: 2022-08-04

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  - conf/vlsit/HongLHHWCLC22
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Zhong-Jie Hong, Demin Liu, Shu-Ting Hsieh, Han-Wen Hu, Ming-Wei Weng, Chih-I Cho, Jui-Han Liu, Kuan-Neng Chen:
Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging. VLSI Technology and Circuits 2022: 387-388

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