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Hidekazu Kikuchi
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Journal Articles
- 2018
- [j3]Masaki Sakakibara
, Koji Ogawa, Shin Sakai, Yasuhisa Tochigi, Katsumi Honda, Hidekazu Kikuchi, Takuya Wada, Yasunobu Kamikubo, Tsukasa Miura, Masahiko Nakamizo, Naoki Jyo, Ryo Hayashibara, Shinya Miyata, Satoshi Yamamoto, Yoshiyuki Ota, Hirotsugu Takahashi, Tadayuki Taura, Yusuke Oike
, Keiji Tatani
, Takayuki Ezaki, Teruo Hirayama:
A 6.9-µm Pixel-Pitch Back-Illuminated Global Shutter CMOS Image Sensor With Pixel-Parallel 14-Bit Subthreshold ADC. IEEE J. Solid State Circuits 53(11): 3017-3025 (2018) - 1986
- [j2]Shigeo Hirose, Hidekazu Kikuchi, Yoji Umetani:
The standard circular gait of a quadruped walking vehicle. Adv. Robotics 1(2): 143-164 (1986) - [j1]Shigeo Hirose, Yasushi Fukuda, Hidekazu Kikuchi:
The gait control system of a quadruped walking vehicle. Adv. Robotics 1(4): 289-323 (1986)
Conference and Workshop Papers
- 2018
- [c4]Masaki Sakakibara
, Koji Ogawa, Shin Sakai, Yasuhisa Tochigi, Katsumi Honda, Hidekazu Kikuchi, Takuya Wada, Yasunobu Kamikubo, Tsukasa Miura, Masahiko Nakamizo, Naoki Jyo, Ryo Hayashibara, Yohei Furukawa, Shinya Miyata, Satoshi Yamamoto, Yoshiyuki Ota, Hirotsugu Takahashi, Tadayuki Taura, Yusuke Oike, Keiji Tatani, Takashi Nagano, Takayuki Ezaki, Teruo Hirayama:
A back-illuminated global-shutter CMOS image sensor with pixel-parallel 14b subthreshold ADC. ISSCC 2018: 80-82 - 2016
- [c3]Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi, Hidekazu Kikuchi, Azusa Yanagisawa, Akio Nakamura:
Wet cleaning process for high-yield via-last TSV formation. 3DIC 2016: 1-4 - 2013
- [c2]Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma
, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, Koji Kondo:
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack. 3DIC 2013: 1-8 - 2010
- [c1]Akihiro Horibe, Kuniaki Sueoka, Katsuyuki Sakuma
, Sayuri Kohara, Keiji Matsumoto, Hidekazu Kikuchi, Yasumitsu Orii, Toshiro Mitsuhashi, Fumiaki Yamada:
High density 3D integration by pre-applied Inter Chip Fill. 3DIC 2010: 1-5
Coauthor Index
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