"Thermal design guideline and new cooling solution for a three-dimensional ..."

Keiji Matsumoto et al. (2013)

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DOI: 10.1109/3DIC.2013.6702329

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, Koji Kondo:
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack. 3DIC 2013: 1-8

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