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J. P. Rebrasse

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Journal Articles

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2010
[j4]
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  - journals/mr/AubertRMLF10
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  - https://dblp.org/rec/journals/mr/AubertRMLF10
A. Aubert, J. P. Rebrasse, Lionel Dantas de Morais, Nathalie Labat, Hélène Frémont:
Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. Microelectron. Reliab. 50(9-11): 1688-1691 (2010)
2008
[j3]
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A. Aubert, Lionel Dantas de Morais, J. P. Rebrasse:
Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations. Microelectron. Reliab. 48(8-9): 1144-1148 (2008)
2007
[j2]
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  - journals/mr/DebledsRMFPM07
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S. Debleds, J. P. Rebrasse, Lionel Dantas de Morais, I. Frapreau, R. Perdreau, B. Morillon:
Localization of sensitive areas of power AC switch under thermal laser stimulation. Microelectron. Reliab. 47(9-11): 1569-1573 (2007)
[j1]
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Lionel Dantas de Morais, F. Allanic, F. Roqueta, J. P. Rebrasse:
Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections. Microelectron. Reliab. 47(9-11): 1614-1618 (2007)

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