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Günther A. Maier

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Journal Articles

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2018
[j2]
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  dblp key:
  - journals/mr/WlanisHELSGRM18
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  persistent URL:
  - https://dblp.org/rec/journals/mr/WlanisHELSGRM18
Thomas Wlanis, René Hammer, Werner Ecker, Sandrine Lhostis, Clément Sart, Sébastien Gallois-Garreignot, Bernhard Rebhan, Günther A. Maier:
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. Microelectron. Reliab. 86: 1-9 (2018)
2015
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Ronald Schöngrundner, Megan Jo Cordill, Günther A. Maier, Hans-Peter Gänser:
Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations. Microelectron. Reliab. 55(11): 2382-2390 (2015)

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