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ORCIDFeilong Zhang 0001
Person information
- affiliation: University of California Riverside, Riverside, CA, USA
Other persons with the same name
- Feilong Zhang — disambiguation page
- Feilong Zhang 0002 — Harbin Institute of Technology, Harbin, China
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Journal Articles
- 2020
[j3]Chenkun Wang
, Feilong Zhang, Fei Lu, Qi Chen, Cheng Li, Albert Z. Wang:
A Study of Transient Voltage Peaking in Diode-Based ESD Protection Structures in 28nm CMOS. IEEE Access 8: 87164-87172 (2020)- 2019
- [j2]Feilong Zhang, Chenkun Wang, Fei Lu, Qi Chen, Cheng Li, X. Shawn Wang, Daguang Li, Albert Z. Wang:
A Full-Chip ESD Protection Circuit Simulation and Fast Dynamic Checking Method Using SPICE and ESD Behavior Models. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(3): 489-498 (2019) - 2016
- [j1]Fei Lu, Rui Ma, Zongyu Dong, Li Wang, Chen Zhang, Chenkun Wang, Qi Chen, X. Shawn Wang, Feilong Zhang, Cheng Li, He Tang, Yuhua Cheng, Albert Z. Wang:
A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS. IEEE Trans. Circuits Syst. I Regul. Pap. 63-I(10): 1746-1757 (2016)
Conference and Workshop Papers
- 2019
- [c7]Cheng Li, Feilong Zhang, Mengfu Di, Zijin Pan, Albert Z. Wang:
Developing 3D Heterogeneous Structures for Future Chips. ICICDT 2019: 1-4 - 2018
- [c6]Chenkun Wang, Fei Lu, Qi Chen, Feilong Zhang, Cheng Li, Dawn Wang, Albert Z. Wang:
A study of impacts of ESD protection on 28/38GHz RF switches in 45nm SOI CMOS for 5G mobile applications. RWS 2018: 157-160 - [c5]Qi Chen, Chenkun Wang, Feilong Zhang, Cheng Li, Albert Z. Wang:
3D heterogeneous integration enabling future RF ICs. RWS 2018: 188-190 - 2017
- [c4]Qi Chen, Cheng Li, Fei Lu, Chenkun Wang, Feilong Zhang, Tianru Wu, Xiaoming Xie, Kun Zhang, Xinxin Li, Jimmy Ng, Ya-Hong Xie, Yuhua Cheng, Albert Z. Wang:
Characterization of single-crystalline graphene ESD interconnects. ASICON 2017: 977-980 - [c3]Albert Z. Wang, Fei Lu, Qi Chen, Chenkun Wang, Cheng Li, Feilong Zhang:
Key note: Integrated design-for-reliability for ICs. LASCAS 2017: 1-4 - [c2]Albert Z. Wang, Qi Chen, Cheng Li, Fei Lu, Chenkun Wang, Feilong Zhang, X. Shawn Wang, Jimmy Ng, Ya-Hong Xie, Rui Ma, Li Wang, Lin Lin:
More-Than-Moore: 3D heterogeneous integration into CMOS technologies. NEMS 2017: 1-4 - [c1]Qi Chen, Cheng Li, Fei Lu, Chenkun Wang, Feilong Zhang, Albert Z. Wang, Jimmy Ng, Ya-Hong Xie:
TLP measurement and analysis of graphene NEMS switches for on-chip ESD protection. NEMS 2017: 370-374
Coauthor Index
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